ELECTROLYTIC PLATING APPARATUS

摘要

The present invention relates to an electrolytic plating apparatus. The electrolytic plating apparatus according to the present invention includes a plating bath for storing an electrolytic plating solution; an anode and a cathode dipped inside the electrolytic plating solution; a plating solution outlet installed inside the plating bath to supply and circulate the electrolytic plating solution; and a contact jig which has elasticity and is installed on top of the plating bath. The circumference of the contact jig is made of an electric conductor so that a wafer substrate is placed on the top of the contact jig.