发明名称 ELECTRONIC COMPONENT TO BE EMBEDDED IN SUBSTRATE AND COMPONENT EMBEDDED SUBSTRATE
摘要 An electronic component to be embedded in a substrate is configured so that planar coils protected by insulators are sandwiched be a pair of magnetic layers. Ports, or openings or absent parts are provided at predetermined positions of one or both of the magnetic layers, and the predetermined positions correspond to the positions opposite to terminal electrodes of the planar coils. Accordingly, a contribution to reduction of the size and weight of electronic equipment can be made.
申请公布号 KR101373540(B1) 申请公布日期 2014.03.12
申请号 KR20127022470 申请日期 2011.05.11
申请人 发明人
分类号 H01F10/06;H01F17/00 主分类号 H01F10/06
代理机构 代理人
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