SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

摘要

The present invention relates to a semiconductor package and a method for fabricating the same. The semiconductor package includes a semiconductor substrate which has bonding pads which are separate from each other; an insulating layer which is formed on the upper part of the semiconductor substrate to have an opening part which exposes the bonding pad; a metal base layer which is formed on the upper part of the insulating layer and the bonding pad; a solder bump which is formed on the upper part of the metal base layer to be electrically connected to the bonding pad; and an etch stop layer which is formed on the upper part of the base layer to surround the solder bump. According to the present invention, the generation of an under cut in etching the metal base layer can be minimized.