| 摘要 |
The present invention relates to a device for removing residual gas and impurities using vacuum and pressurization and, more specifically, to a device for removing the residual gas and the impurities using vacuum and pressurization capable of filling nitride gas into the FOUP at high pressure or repeatedly maintaining the inside of the FOUP in a vacuum condition and efficiently removing the residual gas and impurities inside the FOUP. The present invention includes a vacuum pump for discharging the nitride gas and impurities in a processing chamber by being connected to a nitride supplying part where the nitride gas is stored, and to a supplying pipe connected to the nitride supplying part, by being connected to the processing chamber where the FOUP, which is transferring a wafer, is transferred through the discharging pipe. |
