| 摘要 |
The present invention relates to a multi-chip semiconductor apparatus and, more particularly, to a multi-chip semiconductor apparatus with improved area efficiency. The multi-chip semiconductor apparatus includes multiple stacked semiconductor chips electrically connected by through electrodes. Each semiconductor chip includes a first data input/output line transmitting data for a first memory bank, a second data input/output line transmitting data for a second memory bank, and a data transmission/reception part electrically connecting the first through electrode to one of the first and the second data input/output line in response to the memory bank information selected in the data input/output mode for a corresponding semiconductor chip. |
