发明名称 |
Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element |
摘要 |
An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region. |
申请公布号 |
US8669666(B2) |
申请公布日期 |
2014.03.11 |
申请号 |
US20100907683 |
申请日期 |
2010.10.19 |
申请人 |
HAMMER MARKUS;RUHL GUENTHER;STRASSER ANDREAS;MELZL MICHAEL;GOELLNER REINHARD;GROTELOH DOERTHE;INFINEON TECHNOLOGIES AG |
发明人 |
HAMMER MARKUS;RUHL GUENTHER;STRASSER ANDREAS;MELZL MICHAEL;GOELLNER REINHARD;GROTELOH DOERTHE |
分类号 |
H01L23/48;H01L23/58 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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