发明名称 |
Solid-state imaging device, manufacturing method thereof, and electronic apparatus |
摘要 |
Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are formed and a second semiconductor chip section in which a logic circuit and a multilayer wiring layer are formed to each other in such a manner that the multilayer wiring layers are opposed to each other and are electrically connected to each other; and a light blocking layer configured to be formed by an electrically-conductive film of the same layer as a layer of a connected interconnect of one or both of the first and second semiconductor chip sections near bonding between the first and second semiconductor chip sections. The solid-state imaging device is a back-illuminated solid-state imaging device. |
申请公布号 |
US8669602(B2) |
申请公布日期 |
2014.03.11 |
申请号 |
US201213362758 |
申请日期 |
2012.01.31 |
申请人 |
HAYASHI TOSHIHIKO;SONY CORPORATION |
发明人 |
HAYASHI TOSHIHIKO |
分类号 |
H01L31/062 |
主分类号 |
H01L31/062 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|