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发明名称
堆叠晶片组、具堆叠晶片组之封装件及其制法
摘要
申请公布号
TWI430427
申请公布日期
2014.03.11
申请号
TW099136895
申请日期
2010.10.28
申请人
矽品精密工业股份有限公司 台中市潭子区大丰路3段123号
发明人
黄品诚;黄惠暖;赵俊杰;邱启新
分类号
H01L25/065;H01L23/31;H01L21/56
主分类号
H01L25/065
代理机构
代理人
陈昭诚 台北市中正区杭州南路1段15之1号9楼
主权项
地址
台中市潭子区大丰路3段123号
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