| 摘要 |
<p>A chip transfer apparatus according to the present invention comprises: an arm operating module which has two arms symmetrically mounted at the sides of a rotary shaft, and rotates or vertically moves the rotary shaft; an ejector module which is placed at the lower part of a wafer frame, and adjusts the vertical position of the wafer frame or the horizontal position of a needle by corresponding to each arm of the arm operating module; a sub-chuck module which is placed at the lower part of a bin frame, and adjusts the vertical position of the bin frame by corresponding to each arm of the arm operating module; and a control unit which controls the operation of the arm operating module, the ejector module, and the sub-chuck module. The chip transfer apparatus has multiple arm operating modules, and the control unit controls in order to prevent a collision among the arms of the arm operating modules, thereby improving the velocity and the accuracy of chip transferring.</p> |
