THREE DIMENSIONAL (3D) FAN-OUT PACKAGING MECHANISMS

摘要

A mechanism of forming an above-mentioned semiconductor device package provides manufacturing process of low costs due to a relatively simple process flow. The distortion of a total package is greatly reduced by forming an interconnection structure which is under a package structure and can bond at least one die. The interconnection structure reduces particle contamination without using a molding compound. A decrease in the distortion and particles increases yield. Moreover, a semiconductor package which is formed under the package structure and the interconnection structure is fit with a low form factor with at least one die.