| 摘要 |
A substrate processing apparatus includes a conveying arm configured to convey a substrate and including an electrostatic chuck for attracting the substrate placed on the conveying arm; and a control unit configured to not apply a voltage for causing the electrostatic chuck to attract the substrate between electrodes of the electrostatic chuck when the substrate is placed on the conveying arm but the conveying arm is not moving, and to apply the voltage between the electrodes of the electrostatic chuck when the substrate is placed on the conveying arm and the conveying arm is moving. |
