APPARATUS FOR TREATING SUBSTRATE

摘要

The present invention provides an apparatus for treating a substrate to exhaust an inside of a chamber. The apparatus for treating a substrate includes a housing provided therein with a space in which a substrate is treated; a spin head disposed in the housing to support the substrate; a spraying unit to spray a chemical solution to the substrate supported by the spin head; and an exhaust unit to provide sound pressure to the space. The exhaust unit includes a drain pipe connected to the housing; an exhausting member to provide the sound pressure to the drain pipe; a connection pipe connected to the drain pipe between the exhausting member and the housing; a sensor to measure internal pressure of the connection pipe; and a purge gas supply member installed at the connection pipe to supply purge gas to the connection pipe. Accordingly, the purge gas is supplied to the connection pipe so that a process by-product accumulated in the connection pipe can be removed. [Reference numerals] (590) Control unit