BUMP STRUCTURES FOR SEMICONDUCTOR PACKAGE

摘要

A package structure includes a first substrate which is bonded to a second substrate by connecting the metal pillars of the first substrate to the connectors on the second substrate. The first meal pillar is on the metal pad of the first region of the first substrate and is electrically connected to the metal pad. A second metal pillar is formed on a passivation layer which is in the second region of the second substrate. A first solder combination region is formed between the metal pillar and the first connector. A second solder combination region is formed between a second metal pillar and a second connector. The thickness of the first metal pillar is greater than that of the second metal pillar.