| 摘要 |
A printed circuit board and a method for manufacturing the same are provided to minimize malfunction by preventing penetration of moisture by increasing a bonding force between components. A printed circuit board includes a plurality of circuit pattern layers, insulating members(110,1100), vias(140), and solder resist layers(160). The insulating members are formed by at least one layer to separate the circuit pattern layers electrically. The vias electrically connect some regions of the circuit pattern layers insulated by the insulating members. The solder resist layers are applied to the insulating members on which the circuit pattern layers are formed. Tie-layers are formed on lower parts of circuit patterns(130,1300) formed on surfaces of the insulating members. Roughness forming layers(150,1500) are formed on the surfaces of the insulating members. |
