发明名称 |
SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT |
摘要 |
According to the present invention, provided is a substrate with built-in electronic components, which comprises: a first insulating substrate which has one or more first conductive patterns; a core unit which is formed on one side of the first insulating substrate; one or more first electronic components which are placed in the core unit and have a ring-shaped coil electrically connected to the first conductive pattern; and a dummy pad which is formed inside the coil by being separated from the coil and includes copper (Cu). |
申请公布号 |
KR20140028394(A) |
申请公布日期 |
2014.03.10 |
申请号 |
KR20120094542 |
申请日期 |
2012.08.28 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOON, MIN HEE;CHOI, YOUNG SIK |
分类号 |
H05K3/46;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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