发明名称 CONDUCTIVE INK COMPOSITION, FORMATION OF CONDUCTIVE CIRCUIT, AND CONDUCTIVE CIRCUIT
摘要 The present invention provides a method for forming a conductive circuit which forms a circuit in a printing method by using an ink composition for defining a conductive circuit containing a thixotropic agent such as carbon black and conductive particles which have a density of less than or equal to 2.75 g/cm3 and contain a mixture of a precursor for forming silicon rubber and a hardening catalyst without a solvent substantially. After a printed pattern of a dot shape with a diameter of 0.8 mm and a height of 0.4 mm is formed, the printed pattern is hardened by heat at 80-200°C. A height change rate of the dot shape is less than 5% when comparing the printed shape with the hardened shape. According to the method for forming a conductive circuit, the circuit can be formed in the printing method such as screen printing by using an ink having thixotropy and excellent printing performance. Moreover, the formed circuit has excellent shape reproducibility, and high speed printing can be possible so that the pattern with a high throughput and a high yield can be formed.
申请公布号 KR20140029281(A) 申请公布日期 2014.03.10
申请号 KR20130102890 申请日期 2013.08.29
申请人 SHIN-ETSU CHEMICAL CO., LTD. 发明人 HAMADA YOSHITAKA;YAMAKAWA NAOKI
分类号 B41M1/22 主分类号 B41M1/22
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