SEMICONDUCTOR CHIP, SEMICONDUCTOR STACK PACKAGE HAVING THE CHIP AND CHIP SELECTION METHOD FOR THE SAME

摘要

Disclosed are a semiconductor chip capable of selecting a chip by a simple method and a short signal path without increasing the size of a stack package, a semiconductor package having the same, and a method of selecting the chip of the semiconductor package. The stack package of the present invention includes stacked semiconductor chips including a plurality of chip selection vias and a chip enable pad which is coupled with the chip selection vias and is separated from the chip selection vias; a substrate where the semiconductor chips are mounted and has a contact pad; and a connection member which is electrically connected to the chip selection vias of each semiconductor chip and the chip enable pad.