| 摘要 |
Disclosed are methods and apparatus for operating a plasma processing chamber of a plasma processing tool in at least two modes. In a first mode, a substrate-bearing assembly can move within a gap-adjustable range to adjust a gap between electrodes to receive different processing requirements. In the first mode, RF ground return path continuity is maintained regardless of gap distance when the gap distance is within the gap-adjustable range. In a second mode, the substrate-bearing assembly can move to further open the gap to receive the loading and unloading of the substrate without disturbance. |
