| 摘要 |
After a wafer attached to a protective tape is separated from a chip, a chip-shaped protective tape is partly separated from the chip by rolling it with a tube shape along a first axis by interposing a bonding tape and heating the chip which is maintained in a ring frame. While a separation tape which has a strong bonding layer in a bonding part to a chip distribution region compared to a part facing the outer region of the wafer is pressured by a bonding roller and it is attached to at least the chip distribution region. The rolled tube-shaped protection tape is wholly separated and removed from the chip by separating the separation tape. [Reference numerals] (35) Control device |
