APPARATUS FOR TREATING SUBSTRATE

摘要

The present invention provides a method and an apparatus of baking a substrate on which a chemical solution is coated. An apparatus for treating a substrate includes a housing having an inner space, a chamber which is located in the inner space and has a process space, a heating plate which is located in the chamber and supports the substrate, a heating member which heats the substrate supported by a support unit, and a gas supply unit which supplies an ambient gas into the inner space. The gas supply unit includes a temperature control member which controls the ambient gas. Thereby, thickness variation according to a region where the chemical solution is coated can be minimized.