| 摘要 |
The present invention relates to a method of fabricating a large area encapsulation glass for an OLED using frit with a low melting point, more specifically, to a method of fabricating a large area encapsulation glass for an OLED using frit with a low melting point capable of improving bonding strength and laser sealing efficiency. To this end, the present invention provides the method of fabricating a large area encapsulation glass for an OLED using frit with a low melting point, including a first step of printing frit on the edges of a cover glass; a second step of placing a background substrate with OLEDs on the frit so as to make the background substrate face the cover glass; and a third step of platering the frit, wherein the frit is printed to have a thickness of 20-30μm in the first step. |
