摘要 |
The elastic membrane of the present invention reduces the polishing speed distribution range, enhances the evenness on the surface of the polished surface of the substrate and improves the yield in a pressurized area which enlarges in a concentric circle along the radius direction of the substrate. The elastic membrane (10) has multiple periphery walls (10a to 10h) arranged in a concentric circular form partitioning multiple pressurizing areas (CA, EA, MA1 to MA6). The area width in the radius direction of at least one middle pressurizing area, for instance, middle pressurizing areas (MA5 and MA6) among multiple middle pressurizing areas (MA1 to MA6) formed between the central pressurizing area (CA) in a disk form positioned in the center and the edge pressurizing area (EA) in a ring form positioned in the outermost circumference is set as an area width within a range that a polishing speed response width does not change with changes of the area width. [Reference numerals] (32) Fluid supply source; (40) Control device |