PLATING EQUIPMENT

摘要

The present invention relates to a plating device. The plating device according to an embodiment of the present invention comprises: a hanger part for fixing a plated object; a guide rail which the hanger part is coupled with guiding the movement of the hanger part; a busbar formed to face the guide rail supplying an electrical current; and a current collecting part being in contact with the busbar transferring the electrical current to the hanger part.