发明名称 CONDUCTIVE PASTE AND CONDUCTIVE PATTERN
摘要 PURPOSE: A conductive paste is provided to have excellent printability and to form micro conductive pattern which is able to obtain excellent electrical properties without using high temperature processes. CONSTITUTION: A conductive paste comprises silver powder of which average particle diameter measured through a scanning electron microscope is 0.6-1.0 micron, a tap density is 4.9-6.0 g/cm^3, and a specific surface area is 0.7-1.3 m^2/g, at least one kind of a binder resin selected from a thermosetting resin, a thermoplastic resin and a heat-dryable resin, and an organic solvent. A forming method of a conductive pattern comprises a step of forming a coating pattern printed by using the conductive paste, and a step of drying and/or curing the conductive pattern at 80-200°C.
申请公布号 KR101371863(B1) 申请公布日期 2014.03.07
申请号 KR20120031500 申请日期 2012.03.28
申请人 发明人
分类号 H01B1/22;H05K3/40 主分类号 H01B1/22
代理机构 代理人
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