| 摘要 |
<p>Disclosed are: a thermosetting resin composition which has high hardness when cured, has excellent resistance to thermal discoloration, resistance to UV-ray discoloration, strength and flexibility, suppresses damage to a package even under reflow or a heat cycle, and is suitable in the field of electronic materials and for sealing optical semiconductors; and an epoxy silicone resin used therein. The epoxy silicone resin has an epoxy equivalent weight (g/eq) of 200 to 2000 and is represented by general formula (1), and the thermosetting resin composition contains the same. In the formula, R1 and R2 are a hydrocarbon group, E1 is an organic residue having an epoxy group, and Z is a bivalent group.</p> |
