发明名称 |
SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF |
摘要 |
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed. |
申请公布号 |
KR20140027313(A) |
申请公布日期 |
2014.03.06 |
申请号 |
KR20137031091 |
申请日期 |
2012.05.23 |
申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
HIRAO HIROHIKO;YAMAJI NORIAKI;NAKANISHI MASATO;MURAI TAKAYUKI |
分类号 |
C23C22/52;B23K35/36;C07D233/64;C23F11/14;C23F11/16;H05K3/28 |
主分类号 |
C23C22/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|