| 摘要 |
The present invention relates to a sealing member for semiconductor equipment. According to the embodiment of the present invention, the sealing member for semiconductor equipment includes a mina body (110) which seals between a first member (200) and a second member (300), has a circular ring shape in a center part to form a hollow part (190), and is inserted with 70% or more of a height (H) into a groove (210) formed in the first member (200), and a first extension part (150) which is extended from the upper part of the main body (110) which is located outside the groove (210) toward a hollow part (190) and is arranged between the first member (200) and the second member (300). |
