| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy plate for an FPC substrate excellent in heat release property, processability in repeated bending, shape maintenance property, and heat resistance.SOLUTION: A copper alloy plate contains a total of 0.01 mass% or more of one or more kinds selected from a group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn and Zr, wherein the content of Ag is 1.0 mass% or less, the content of Ti is 0.08 mass% or less, the content of Ni is 2.0 mass% or less, the content of Zn is 3.5 mass% or less, and the content of one or more kinds selected from a group consisting of Cr, Fe, In, P, Si, Sn, and Zr is 0.5 mass% or less in total, and the balance consisting of Cu and impurities. The copper alloy plate has conductivity of 60% IACS or more, tensile strength of 350 MPa or more, and the number n of shear bands crossing each 2 straight lines of total 3 straight lines vertical to a thickness direction dividing material thickness, T into four on a rolling parallel cross section excluding a central line in an observation range of the length of each line 100T satisfying n≤300. |
