| 摘要 |
An ESD protection device is described, including a substrate of a first conductivity, a well of a second conductivity, a transistor including a first doped region of the second conductivity located in the substrate and extending into the well, a second doped region of the first conductivity and a gate over the substrate between the two doped regions, a third doped region of the second conductivity and a fourth doped region of the first conductivity disposed in the substrate in sequence from an outer side of the second doped region and coupled to ground, and a fifth doped region of the first conductivity and a sixth doped region of the second conductivity disposed in the well in sequence from an outer side of the first doped region and coupled to a bonding pad. When an ESD voltage is applied to the bonding pad, it is coupled to the gate. |
