| 发明名称 |
CHUCK AND SEMICONDUCTOR PROCESS USING THE SAME |
| 摘要 |
An apparatus of semiconductor process including a chuck and a vacuum source is provided. The chuck has a plurality of holes for holding a semiconductor substrate, and the vacuum source is used for providing vacuum suction through the holes to make the semiconductor substrate be subjected to varied suction intensities according to a warpage level thereof. |
| 申请公布号 |
US2014065553(A1) |
申请公布日期 |
2014.03.06 |
| 申请号 |
US201213600231 |
申请日期 |
2012.08.31 |
| 申请人 |
JANG CHUNG-SUNG;LIN MING-TSE;LIN YUNG-CHANG;UNITED MICROELECTRONICS CORPORATION |
发明人 |
JANG CHUNG-SUNG;LIN MING-TSE;LIN YUNG-CHANG |
| 分类号 |
H01L21/683;B23Q17/20;G03F7/20 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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