| 摘要 |
A semiconductor structure includes a semiconductor substrate, a metal layer formed on the semiconductor substrate, a conductive pillar, and a solder ball. The conductive pillar is formed on and electrically connected with the metal layer, wherein the conductive pillar has a bearing surface and a horizontal sectional surface under the bearing surface, and the contact surface area of the bearing surface is larger than the area of the horizontal sectional surface. The solder ball is located on the conductive pillar and covers the bearing surface. |
