LUMINAIRE

摘要

An LED module substrate comprises: a substrate body; an LED element mounted on one surface of the substrate body; and a contact point electrically connected with the LED element by being mounted on the edge part of one surface of the substrate body. A heat dissipation sheet is installed to be thermally connected to the other side of the substrate body and covers the other surface. A cover unit covers the LED module substrate as exposing the contact point. A socket allows a lamp to be mounted thereon and has a terminal electrically connected with the contact point when the lamp is mounted. A device body comprises a heat dissipation body having a contact surface and a dented portion. The contact surface is thermally connected as the lamp mounted on the socket touches therewith. The dented portion is installed in a position opposite to the terminal of the socket.