INSPECTION APPARATUS, BONDING SYSTEM, INSPECTION METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To appropriately inspect a bonding state of a superposed substrate with an inspection apparatus, while miniaturizing an inspection apparatus for inspecting the superposed substrate in which substrates are bonded to each other.SOLUTION: An inspection apparatus 50 for inspecting a superposed wafer Wcomprises: a first holding part 290 for holding a rear surface of the superposed wafer Wand having a notch 295; a second holding part 310 for holding and rotating the superposed wafer W; an infrared irradiation part 320 for irradiating the superposed wafer Wheld by the first holding part 290 with infrared ray; an imaging part 330 for receiving infrared ray applied from the infrared irradiation part 320 and for dividing and imaging the superposed wafer Wheld by the first holding part 290; and a displacement meter 350 for measuring displacements of external surfaces of an upper wafer Wand a lower wafer Wforming the superposed wafer Wrespectively m, while rotating the superposed wafer Wheld by the second holding part 310.