发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with improved reliability in which a defect caused by an end portion of a semiconductor layer provided in an island shape is prevented, and a method for manufacturing the semiconductor device.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: forming an island-shaped semiconductor layer on a substrate having an insulating surface; subjecting a first alteration processing; forming a first insulating film on a surface of the island-shaped semiconductor layer; removing the first insulating film; subjecting a second alteration processing to the island-shaped semiconductor layer from which the first insulating film is removed; forming a second insulating film on the surface of the island-shaped semiconductor layer; and forming a conductive layer on the second insulating film. An upper end portion of the island-shaped semiconductor layer is rounded by the first alteration processing and the second alteration processing.
申请公布号 JP2014042051(A) 申请公布日期 2014.03.06
申请号 JP20130214517 申请日期 2013.10.15
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 OKAMOTO SATORU
分类号 H01L29/786;H01L21/28;H01L21/336 主分类号 H01L29/786
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