发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with improved reliability in which a defect caused by an end portion of a semiconductor layer provided in an island shape is prevented, and a method for manufacturing the semiconductor device.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: forming an island-shaped semiconductor layer on a substrate having an insulating surface; subjecting a first alteration processing; forming a first insulating film on a surface of the island-shaped semiconductor layer; removing the first insulating film; subjecting a second alteration processing to the island-shaped semiconductor layer from which the first insulating film is removed; forming a second insulating film on the surface of the island-shaped semiconductor layer; and forming a conductive layer on the second insulating film. An upper end portion of the island-shaped semiconductor layer is rounded by the first alteration processing and the second alteration processing. |
申请公布号 |
JP2014042051(A) |
申请公布日期 |
2014.03.06 |
申请号 |
JP20130214517 |
申请日期 |
2013.10.15 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
OKAMOTO SATORU |
分类号 |
H01L29/786;H01L21/28;H01L21/336 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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