LIGHT-EMITTING APPARATUS

摘要

A light-emitting apparatus according to the present invention is provided with a mounting substrate, an LED chip joined to one surface side of the mounting substrate via a joining part, and a sealing part covering the LED chip on the surface side of the mounting substrate. The joining part is capable of transmitting the light radiated from the LED chip. The mounting substrate is provided with a translucent member having a planar size larger than that of the chip size of the LED chip, and a first through wiring and a second through wiring arranged in the thickness direction of the translucent member. The first through wiring is electrically connected to a first electrode of the LED chip, and the second through wiring is electrically connected to a second electrode of the LED chip, respectively, via a first wire and a second wire. The sealing part covers the first wire and the second wire. The translucent member comprises at least two translucent layers overlapping in the thickness direction and having mutually different optical characteristics. The farther from the LED chip the translucent layer is positioned, the higher the layer's reflection rate in relation to light radiated from the LED chip.