| 摘要 |
A method of bonding together at least two aligned layers, at least one having an active surface, in a semiconductor manufacturing process using a holding member having spaced sections. Each layer has a bonding surface opposite a back surface. The method includes preparing at least two bonding pads on the back surface of each layer and positioning close together the bonding surface of each layer. Aligning the bonding pads of the layers together and inserting the aligned layers between sections of at least one holding member and aligning the sections with the bonding pads of the layers. Applying bonding compound to the aligned bonding pads adjacent the aligned sections of the holding member. |
