| 摘要 |
PURPOSE: A chip-on-film package with an improved heat radiation is provided to prevent an overheat by absorbing heat transmitted through a via hole. CONSTITUTION: An insulation layer (210) includes a via hole (212) for a heat radiation. A circuit (230) is located on one side of the insulation layer. An IC is mounted on a chip mounting area (204) and is electrically connected to the circuit. A dummy pattern part (240) is formed on the same layer as the circuit and includes an extension part (242) between the leads of the circuit. The via hole corresponds to the extension part. |
