| 摘要 |
PURPOSE: A loading device for a high pressure processor is provided to uniformly process a wafer with high pressure by circularly supplying a supercritical gas on the surface of the laminated wafer. CONSTITUTION: A pair of first support units(30) include a plurality of support protrusion parts(31). The support protrusion part supports two separated positions of one semicircular part of a plurality of wafers. A pair of second support units(20) include a plurality of support protrusion parts(21). The support protrusion part supports two separated position of the other semicircular part of the plurality of wafers. A top plate(10) and a bottom plate(40) are bonded to the upper side of the first support unit and the lower side of the second support unit, respectively. |
