| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in coating properties, conductivity, adhesiveness, and heat radiation, which produces a cured material excellent in heat resistance and durability with less secular change of these properties in a high temperature state; and a conductive adhesive including the curable resin composition.SOLUTION: A curable resin composition includes: a polyimide silicone resin (A) represented by the following formula (1) having a phenolic hydroxyl group; an epoxy resin (B); a conductive metal powder (C); silica (D), and an organic solvent (E). In the formula, X represents a tetracarboxylic acid residue, Y and Z represent a bisphenol group and a diamine residue having a siloxane structure, respectively, and W represents a diamine residue other than Y and Z. The curable resin composition may be used as a conductive adhesive, improving the productivity of an LED. |
