| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method for substrates in which a mutual position shift between the substrates is suppressed.SOLUTION: The bonding method includes a fixing stage of fixing one of a pair of substrates, a holding stage of holding the other substrate disposed opposite the one substrate in a freely swinging state, a positioning stage of positioning the other substrate in a surface direction of the one substrate, a displacing stage of displacing the other substrate toward the one substrate, and a press-contacting stage of bonding the pair of substrates together by pressing the pair of substrates coming into contact with each other through the displacement of the other substrate. The positioning stage includes a position correcting stage of correcting the position of the other substrate so as to cancel a position shift of the other substrate in the surface direction of the one substrate due to swinging of the other substrate. |
