POWER MODULE

摘要

The present invention is equipped with: lead conductors to which electronic components are mounted; a mold resin that encloses and seals the electronic components and the lead conductors; and electronic components electrically connected to bent parts that include L-shaped portions wherein the lead conductors extend to the outside from the interior of the mold resin and then bend. Thus, it is possible to obtain a power module with which the size of the equipment in which the power module is mounted can be reduced and with which the wiring inductance between connected devices can be lowered, and to obtain a power module that is particularly suitable for a power conversion device.