发明名称 PIXEL VIA AND METHODS OF FORMING THE SAME
摘要 This disclosure provides systems, methods and apparatuses for pixel vias. In one aspect, a method of forming an electromechanical device having a plurality of pixels includes depositing an electrically conductive black mask (23) on a substrate (20) at each of four corners and along at least one edge region of each pixel, depositing a dielectric layer (35) over the black mask, depositing an optical stack (16) including a stationary electrode over the dielectric layer, and depositing a mechanical layer (14) over the optical stack. The method further includes providing a conductive via (138) in a first pixel of the plurality of pixels, the via disposed in the dielectric layer and electrically connecting the stationary electrode to the black mask, the via disposed in a position along an edge of the first pixel, spaced offset from the edge of the first pixel in a direction towards the center of the first pixel.
申请公布号 KR20140027212(A) 申请公布日期 2014.03.06
申请号 KR20137029188 申请日期 2012.03.30
申请人 QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 LEE, HO JIN;ZHONG FAN;TAO YI
分类号 G02B26/00 主分类号 G02B26/00
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