| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic semiconductor device (12) mounted to a push-type laminate assembly.SOLUTION: Lower and upper plates (22, 24) are conductive, and each component (28) comprises a first electrode (42) and a second electrode (44). The first electrode (42) is electrically connected to the lower plate (22), and the second electrode (44) is electrically connected to the upper plate (24). An elastic part (30) is arranged between the component (28), and a support plate (24) selected from the lower plate (22) and the upper plate (24). An intermediate sealing wall (32) is arranged inside a box (20) between the component (28) and the elastic part (30), and electrically connects the component (28). The intermediate sealing wall (32) isolates the component (28) from electrically insulative cooling liquid constituted to circulate around the elastic part (30) between the intermediate sealing wall (32) and the support plate (24). |
