METHOD FOR MANUFACTURING ELECTRONIC DEVICE CASING

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thin electronic device casing excellent in thermal insulation effect.SOLUTION: The method for manufacturing the thin electronic device casing includes: a step of providing a cover and a mold, the cover having an upper surface, the mold having a bottom surface, and forming a recess that is depressed inwardly at the bottom surface of the mold; a step of arranging the mold to cover the cover with the bottom surface of the mold attached on the upper surface of the cover so that a room is cooperatively defined by the recess and the top surface of the cover; a step of filling the room with aerogel solution, and then drying the aerogel solution in the room; and a step of removing the mold from the cover after the aerogel solution is dried completely.