发明名称 POLYAMIDE MOULDING COMPOUNDS AND THEIR APPLICATION
摘要 This invention describes a thermoplastic moulding compound, specifically a polyamide moulding compound, consisting of: (A) 20-88% by weight thermoplastic synthetic, preferably polyamide; (B) 10-70% by weight fibre-shaped aggregates; (B1) 10-70% by weight glass fibres that consist primarily of silicon dioxide, aluminium oxide, and magnesium oxide; (B2) 0-20% by weight glass fibres that differ from the fibres in components (B1); (B3) 0-20% by weight additional fibre-shaped aggregates that differ from the fibres in components (B1) and (B2), are not based on glass, and are selected from the following group: carbon fibres, graphite fibres, aramide fibres, nanotubes; (C) 2-40% by weight particulate filler material; (D) 0-2% by weight additives; whereby the sum of (A) through (D) equals 100% weight.
申请公布号 US2014066561(A1) 申请公布日期 2014.03.06
申请号 US201313968058 申请日期 2013.08.15
申请人 PFLEGHAR MARK;STOPPELMANN GEORG;HARDER PHILIPP;LAMBERTS NIKOLAI;EMS-PATENT AG 发明人 PFLEGHAR MARK;STOPPELMANN GEORG;HARDER PHILIPP;LAMBERTS NIKOLAI
分类号 C08K7/14;C08K3/22;C08K3/26;C08K3/30;C08L77/00 主分类号 C08K7/14
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