LIQUID SEALING EPOXY RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a liquid sealing epoxy resin composition that is excellent in penetrability into narrow gaps, and that forms a cured product excellent in adhesiveness to metals, drop impact resistance, and thermal cycle resistance.SOLUTION: The liquid sealing epoxy resin composition includes: (A) an epoxy resin including an aromatic moiety and an aliphatic moiety, in which the ratio of the aromatic moiety to the aliphatic moiety is 5:95 to 80:20 in molecular weight; (B) a curing agent; and (C) a filler having an average particle diameter of 0.05 μm to 30 μm.