发明名称 THERMOSETTING RESIN COMPOSITION; METHOD FOR MANUFACTURING A HEAT-CONDUCTIVE RESIN SHEET; AND HEAT-CONDUCTIVE RESIN SHEET; AND SEMICONDUCTOR DEVICE FOR POWER APPLICATIONS
摘要 PROBLEM TO BE SOLVED: To obtain a heat-conductive resin sheet affording favorable handling friendliness in yet-to-be-cured and partially-cured states and excellent in terms of heat resistance, heat conductivity, and electric insulating capacity and to obtain a high-performance, high-reliability semiconductor device for power applications.SOLUTION: The provided thermosetting resin composition is obtained by dispersing a heat-conductive filler 3 within a thermosetting resin matrix 2. The filler 3 is a secondary aggregate 3 formed as a result of the aggregation of primary particles 4. The resin matrix 2 is adjusted so as to yield a post-curing glass transition point of 170°C or above and a pre-curing viscosity at 100°C of 20 Pa s or below.
申请公布号 JP2014040533(A) 申请公布日期 2014.03.06
申请号 JP20120183817 申请日期 2012.08.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAKAMURA YURIE;MIMURA KENJI;YIN XIAO HONG;NISHIMURA TAKASHI
分类号 C08L101/12;C08G59/18;C08J5/18;C08K3/38;C08L63/00 主分类号 C08L101/12
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