发明名称 |
THERMOSETTING RESIN COMPOSITION; METHOD FOR MANUFACTURING A HEAT-CONDUCTIVE RESIN SHEET; AND HEAT-CONDUCTIVE RESIN SHEET; AND SEMICONDUCTOR DEVICE FOR POWER APPLICATIONS |
摘要 |
PROBLEM TO BE SOLVED: To obtain a heat-conductive resin sheet affording favorable handling friendliness in yet-to-be-cured and partially-cured states and excellent in terms of heat resistance, heat conductivity, and electric insulating capacity and to obtain a high-performance, high-reliability semiconductor device for power applications.SOLUTION: The provided thermosetting resin composition is obtained by dispersing a heat-conductive filler 3 within a thermosetting resin matrix 2. The filler 3 is a secondary aggregate 3 formed as a result of the aggregation of primary particles 4. The resin matrix 2 is adjusted so as to yield a post-curing glass transition point of 170°C or above and a pre-curing viscosity at 100°C of 20 Pa s or below. |
申请公布号 |
JP2014040533(A) |
申请公布日期 |
2014.03.06 |
申请号 |
JP20120183817 |
申请日期 |
2012.08.23 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
NAKAMURA YURIE;MIMURA KENJI;YIN XIAO HONG;NISHIMURA TAKASHI |
分类号 |
C08L101/12;C08G59/18;C08J5/18;C08K3/38;C08L63/00 |
主分类号 |
C08L101/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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