POLISHING COMPOSITION AND METHOD FOR PRODUCING SUBSTRATE

摘要

A polishing composition containing a water-soluble polymer having a weight average molecular weight of 1,000,000 or less and a molecular weight distribution represented by the weight average molecular weight (Mw)/the number average molecular weight (Mn) of less than 5.0. This polishing composition is used mainly for polishing substrates, preferably for the final polishing of substrates.