Electroless metal deposition for micron scale structures

摘要

A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fibre) comprises introducing into said space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and there after heating said structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The steps of introducing and heating may be repeated as necessary to build up a required thickness.