| 摘要 |
PROBLEM TO BE SOLVED: To provide a feeding device that can efficiently feed a semiconductor device identified as a non-defective article, a method of feeding the semiconductor device and a method of manufacturing the semiconductor device.SOLUTION: In the middle of feeding of a semiconductor device 52 identified as a non-defective article, a feeding device feeds a semiconductor device 52 identified as a defective article arranged at the opposite side to the semiconductor device 52 identified as the non-defective article with respect to the arrangement direction. When a defective semiconductor device 52C is fed, the defective semiconductor device 52C is lifted up from an adhesive sheet 54 by using a grip site 28, whereby the adhesive sheet 54 is deformed and the adhesion between a non-defective semiconductor device 52D arranged at the arrangement direction side and the adhesive sheet 54 is reduced. Accordingly, the non-defective semiconductor device 52D arranged at the arrangement direction side with respect to the defective semiconductor device 52C is efficiently peeled off from the adhesive sheet 54 when lifted up from the adhesive sheet 54 by a grip portion 14. The semiconductor device identified as the non-defective article can be efficiently fed. |
